홈/제품 소개/세라믹 히트 싱크/Warpage≤2‰ Ceramic Heat Sink Designed to Meet frequency Communication Signal Equipment Requirements with Surface Roughness 0.3-08 Um and Cooling
Warpage≤2‰ Ceramic Heat Sink Designed to Meet frequency Communication Signal Equipment Requirements with Surface Roughness 0.3-08 Um and Cooling
Model Number:Ceramic Heat Sink/Ceramic Micro Porous Heat Sink
결제 및 배송 조건
Packaging Details:As customer requirements
Delivery Time:7-15 days
지불 조건:30% TT를 미리 지불하고 선적 전에 잔액을 지불합니다.
갤러리
Warpage≤2‰ Ceramic Heat Sink Designed to Meet frequency Communication Signal Equipment Requirements with Surface Roughness 0.3-08 Um and Cooling
제품 설명
Product Description: The Ceramic Heat Sink is an advanced thermal management solution designed to effectively dissipate heat in a variety of high-performance applications. Manufactured from premium materials such as Silicon Carbide (SiC), Aluminum Oxide (Al₂O₃), Silicon Dioxide (SiO₂), and Aluminum Carbide (Al₄C₃), this heat sink offers exceptional thermal conductivity ranging from 9 to 180 MW/m.K. This wide range in thermal conductivity allows it to cater to diverse thermal